- All sections
- B - Performing operations; transporting
- B24B - Machines, devices, or processes for grinding or polishing; dressing or conditioning of abrading surfaces; feeding of grinding, polishing, or lapping agents
- B24B 37/12 - Lapping plates for working plane surfaces
Patent holdings for IPC class B24B 37/12
Total number of patents in this class: 77
10-year publication summary
5
|
0
|
4
|
10
|
6
|
11
|
9
|
10
|
11
|
1
|
2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
Owner |
All patents
|
This class
|
---|---|---|
Ebara Corporation | 1951 |
13 |
Shin-Etsu Handotai Co., Ltd. | 1277 |
9 |
Applied Materials, Inc. | 16587 |
8 |
Sumco Corporation | 1116 |
8 |
Seagate Technology LLC | 4228 |
6 |
Taiwan Semiconductor Manufacturing Company, Ltd. | 36809 |
3 |
Fujikoshi Machinery Corp. | 54 |
3 |
Fujibo Holdings, Inc. | 97 |
2 |
Maruishi Sangyo Co., Ltd. | 10 |
2 |
Sumitomo Electric Industries, Ltd. | 14131 |
1 |
Intel Corporation | 45621 |
1 |
Denso Corporation | 23338 |
1 |
ASML Netherlands B.V. | 6816 |
1 |
Showa Denko K.K. | 2539 |
1 |
University of Florida Research Foundation, Inc. | 3883 |
1 |
Concria Oy | 12 |
1 |
Fujicopian Co., Ltd. | 39 |
1 |
Fujimi Incorporated | 676 |
1 |
Globalwafers Co., Ltd. | 561 |
1 |
Hermes Testing Solutions Inc. | 9 |
1 |
Other owners | 12 |